Electromigration induced stress analysis using fully coupled mechanical–diffusion equations with nonlinear material properties
نویسندگان
چکیده
Electromigration is a major road block in the pursuit of further miniaturized electronics. In the next generation micro and sub micro electronics current density is expected to exceed 10 A/cm. In this paper an electromigration induced strain-current density model is proposed and implemented in finite element procedure for solution of boundary/initial value electromigration problems. Numerical simulations are compared with experimental data. Comparisons validate the model. 2004 Elsevier B.V. All rights reserved.
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